제품소개
제품소개Solder Paste
| Classification | Description | Alloy Composition (wt,%) |
Particle Size |
Characteristic |
|---|---|---|---|---|
| Medium Temp. & Sn-Ag-Cu Alloy |
LST309M-K21 | Sn-3.0Ag-0.5Cu | Type 4 (20~38㎛) |
For General Use |
| LST309M-K21(D5) | Minimize Void | |||
| LST309M-K21(HF04) | halogen Free | |||
| LST305-T5K22 | Type 5 (15~25㎛) |
For general use | ||
| LST305-T6 | Type 6 (5~15㎛) |
For Microparts | ||
| LST305-T7 | Type 7 (2~11㎛) |
|||
| LST105-ST09 | Sn-1.0Ag-0.5Cu | Type 5 (15~25㎛) |
Low Ag | |
| LST0307-TG01 | Sn-0.3Ag-0.7Cu | Type 4 (20~38㎛) |
||
| LBI385-T4 | Sn-3.5Ag-8.0In-X | Type 4 (20~38㎛) |
Midium & Low Temp | |
| Low Temp. | LBI04-M08E | Sn-57Bi-0.4Ag-X | Type 4 (20~38㎛) |
For Low Temp |
| Water Soluble | LST305-WS-T4 | Sn-3.0Ag-0.5Cu | Type 4 (20~38㎛) |
Semi Conductor |
| LST305-WS-T5 | Type 5 (15~25㎛) |
|||
| LST305-WS-T6 | Type 6 (5~15㎛) |
|||
| LST305-WS-T7 | Type 7 (2~11㎛) |
|||
| Disepnsing or Jetting | LST305-WS-T5(SY) | Type 5 (15~25㎛) |
For Repair (Syringe Type) |
|
| LST305-WS-T6(SY) | Type 6 (5~15㎛) |
